At the annual Annual Snapdragon Tech Summit in 2019 in Hawai, USA, Qualcomm has unveiled three new chipsets that are integrated with 5G modems. The company has announced one flagship processor in the 800 series, the Snapdragon 865 and two mid-range processors in the 700 series – Snapdragon 765 and 765G. The company said that the complete platform details will be shared tonight, on Day 2 of the summit.
The Snapdragon 865 features 5th gen AI engine, 2 gigapixels per second ISP processing, 8K @ 30fps videos, or 64MP 4K video, up to 200 MP camera support, HDR10+ support and it’s a global solution with mmWave, Sub 6 GHz support. The Snapdragon 765 and 765G bring integrated 5G connectivity, AI processing and select Qualcomm Snapdragon Elite Gaming experiences. Smartphones with Snapdragon 865 and 765/765G will be launching in 2020 – regardless of whether users are in 5G or 4G coverage.
The Snapdragon 765/765G 5G mobile platform features Snapdragon X52 5G modem with support for up to 3.7 Gbps speeds with mmWave and Sub 6 support. It comes with 5th Gen AI Engine, 4K HDR capture with computer-vision ISP, 4K60 HDR10+ support and can support a camera up to 192 MP.
Also, the company announced 3D Sonic Max, the latest version of Qualcomm’s ultrasonic fingerprint sensor. 3D Sonic Max offers a recognition area that is 17x larger than the previous generation, allowing for increased security via simultaneous two-finger authentication, increased speed and ease of use.
Xiaomi, Nokia, Lenovo, and OPPO are expected to come with these new powerful chipsets early next year.
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